Test Sockets

Qualmax offers a variety of semiconductor test socket for different device types not only for the advanced packages like BGA/LGA,
QFN/MLF and POP/PIP but also for the conventional packages like PLCC, SOP and QFP.

RF/Coaxial Socket

  • Coaxial Design
  • Air Dielectric or Solid Dielectric
  • Bushing around signal pins
  • 1.00mm long Test Probe
  • Low Inductance
  • 50ohms Impedance controlled
  • Zo Block Design
  • Easy Replacement of Pins
  • Up to 20GHz @ -1dB
  • Qualmax Patent

POP/PIP Test Socket

  • User friendly design
  • Superb signal integrit
  • Short signal path
  • Precise Alignment
  • Outstanding contacts with low contact resistance

Manual Lid

  • Clamshell Type
  • CAM actuated
  • Z-adjust Clamping type
  • Bolt-on-type
  • Thermal Lid (Cooling & Heating)
  • Spring actuation type

WLCSP Test Socket

There is an increasing demand for wafer level testing in the semiconductor industry today.
Qualmax provides wafer-level chip scale package (WLCSP) test sockets for vertical probing applications

  • Pitch: Down to 0.09mm
  • Travel: ›0.2mm
  • Force: 3gf to 30gf
  • Housing Material: Machinable Plastic or Ceramic
  • Cres: 15mOhms to 200mOhms
  • Low cost of Ownership
  • Easy Maintenance
  • Superior Performance and Durability (over a million cycles)
  • Fast Delivery: 2 weeks ARO
  • Bending issue Eliminated

Kelvin Sockets

Kelvin socket eliminates Cres error with 2 isolated probes.
Minimum pitch is down to 0.35mm pitch full array.
Qualmax Kelvin probes are excellent in quality, are low cost and are easy to replace through a drop-in replacement.

  • For Low Resistance testing of QFN, DFN, MLF, LGA and etc.
  • Pitch to 0.3mm
  • Easy Pin Replacement
  • Custome Pin Design with No NRE (Force, Signal Length, Pitch)
  • Stainless Steel or Pd Alloy Top Plunger for maximum Duerability Proble Life Span: › 500,000 cycles
  • Lead Times: › 2 weeks

Test Sockets

  • Test Chip and Memory separately before assembly.
  • Pitch down to 0.3mm
  • Fast Custom Design
  • No NRE