RF/Coaxial Socket

• Coaxial Design
• Air Dielectric or Solid Dielectric
• Bushing around signal pins
• 1.00mm long Test Probe
• Low Inductance
• 50ohms Impedance controlled
• Zo Block Design
• Easy Replacement of Pins
• Up to 40GHz
• Qualmax Patent

POP/PIP Test Socket

• User friendly design
• Superb signal integrit
• Short signal path
• Precise Alignment
• Outstanding contacts with low contact resistance

Manual Lid

• Clamshell Type
• CAM actuated
• Z-adjust Clamping type
• Bolt-on-type
• Thermal Lid (Cooling & Heating)
• Spring actuation type

WLCSP Test Socket

There is an increasing demand for wafer level testing in the semiconductor industry today.
Qualmax provides wafer-level chip scale package (WLCSP) test sockets for vertical probing applications

• Pitch: Down to 0.09mm
• Travel: ›0.2mm
• Force: 3gf to 30gf
• Housing Material: Machinable Plastic or Ceramic
• Cres: 15mOhms to 200mOhms
• Low cost of Ownership
• Easy Maintenance
• Superior Performance and Durability (over a million cycles)
• Fast Delivery: 2 weeks ARO
• Bending issue Eliminated

Kelvin Sockets

Kelvin socket eliminates Cres error with 2 isolated probes.
Minimum pitch is down to 0.35mm pitch full array.
Qualmax Kelvin probes are excellent in quality, are low cost and are easy to replace through a drop-in replacement.

• For Low Resistance testing of QFN, DFN, MLF, LGA and etc.
• Pitch to 0.3mm
• Easy Pin Replacement
• Custome Pin Design with No NRE (Force, Signal Length, Pitch)
• Stainless Steel or Pd Alloy Top Plunger for maximum Duerability Proble Life Span: › 500,000 cycles
• Lead Times: › 2 weeks

Test Sockets

• Test Chip and Memory separately before assembly.
• Pitch down to 0.3mm
• Fast Custom Design
• No NRE