Qualmax provides total solution for spring contact probe (pogo pin) and semiconductor test socket
Semiconductor IC Test Socket & Spring Contact Probe (pogo pin) for Semiconductor Test Industry

Semiconductor IC Test Socket, Pogo Pin, Spring Contact Probe 

Categories
Spring Contact Probe
Semiconductor Test Socket

What We Offer
Semiconductor Test Socket
Spring Contact Probe
Test Socket Lid
Custom Support Plate
Application Engineering
Free Custom Design
Technical Support
Local Stocking of Inventory
Supports JIT Manufacturing
Quality Standard Set-up

Our Commmitment
Product Excellence
In-depth ApplicationConsulting
Intelligent Design Engineering
Precision Manufacturing
Stringent Quality Control
Two Weeks Lead Time 

No NRE Charge
No Tooling Charge
Flexible Approach
Goal Oriented Customer Care

Benefits for You
Highest Quality Product
Best Test Yield
Shortest Lead Time
Shortest Time-to-Market
Competitive Price
Intensive Local Support
One Stop Total Solution

 

Total solution for Spring Contact Probe (pogo pin) and Semiconductor IC Test Socket, Test Fixture, Test Automation

IC test socket BGA test socket Dual Site WLCSP Test Socket

Semiconductor IC Test Socket

Qualmax offers variety of semiconductor test socket for different device types not only for the advanced packages like BGA/LGA, QFN/MLF and POP/PIP, but also for the conventioanl packages like PLCC, SOP and QFP.

  • Manual Test Socket
  • Production Test Socket
  • Lids : Clamshell, CAM Actuated, Z-adjust, Thermal Lid, Bolt-on, Spring Actuated
  • Wafer Level Package (WLP) Test Socket
  • RF Applications: Coaxial Design, Air Dielectric or Solid Dielectric, Teflon Sleeved Probe, Impedence Controlled
  • POP/PIP/SIP Socket  
  • Pitch to 0.125mm
  • Support Plates
  • Design completion within 3 business days
  • Delivery within 2 to 3 weeks after the drawing approval

RF Test Socket (Example)

3D model of RF test socket image of RF test socket

  • Bandwidth : upto 30GHz
  • Pin to Pin isolation : better than 70dB upto 2.6GHz
  • Return loss for 50 Ohms terminated pin : better than 30dB upto 2.6GHz
  • Coaxial probe sockets are available
  • Special material for noise isolation
  • Very short signal path using high quality spring probe

POP/PIP Test Socket (Example)

         3D model of POP Socket           image of POP socket

Elastomeric Test Socket

  • Thickness (Height): 0.50mm to 1.20mm
  • Pitch: 0.2mm to 1.27mm
  • Packages: BGA, LGA, TBGA, FBGA, MLF, QFN, ULGA, QFP and etc.
  • Recommended Travel: 30% of the thickness
  • Low CRES: <100 mOhms
  • CCC: 2.5A for 0.5mm pitch
  • Pin Count: >3000

image of elastomer socketimage of elastomer test socketimage of elastomer test socket

 

Machining Capability

  • Super Precision 40,000 RPM Vertical Machining Center
  • Down to 0.040mm (0.0016") diameter holes with 0.010mm wall thickness 
  • Very tight machining tolerance 
  • Burr free hole fabrication
  • Machinging all kinds of engineering plastic material 
  • Machine ceramic substrate for WLCSP test socket

Vertical Machine Center to make Test Socket Housing 

    

   

 

 

Total Solution for Semiconductor IC Test Socket and Spring Contact Probe (Pogo Pin). Factory Direct. info@qualmax.com.